19
2503QS–AVR–02/11
ATmega32(L)
Changes from Rev.
2503D-02/03 to
Rev. 2503E-09/03
1.
Updated and changed “On-chip Debug System” to “JTAG Interface and On-chip
Debug System” on page 35.
2.
Updated Table 15 on page 37.
3.
Updated “Test Access Port – TAP” on page 219 regarding the JTAGEN fuse.
4.
Updated description for Bit 7 – JTD: JTAG Interface Disable on page 228.
5.
Added a note regarding JTAGEN fuse to Table 104 on page 257.
6.
Updated Absolute Maximum Ratings* , DC Characteristics and ADC Characteristics in
“Electrical Characteristics” on page 287.
7.
Added a proposal for solving problems regarding the JTAG instruction
IDCODE in
“Errata” on page 336
.
Changes from Rev.
2503C-10/02 to
Rev. 2503D-02/03
1.
Added EEAR9 in EEARH in “Register Summary” on page 327.
2.
Added Chip Erase as a first step in“Programming the Flash” on page 284 and “Pro-
gramming the EEPROM” on page 285.
3.
Removed reference to “Multi-purpose Oscillator” application note and “32 kHz Crys-
tal Oscillator” application note, which do not exist.
4.
Added information about PWM symmetry for Timer0 and Timer2.
5.
Added note in “Filling the Temporary Buffer (Page Loading)” on page 251 about writ-
ing to the EEPROM during an SPM Page Load.
6.
Added “Power Consumption” data in “Features” on page 1.
7.
Added section “EEPROM Write During Power-down Sleep Mode” on page 22.
8.
Added note about Differential Mode with Auto Triggering in “Prescaling and Conver-
sion Timing” on page 204.
9.
Updated Table 89 on page 232.
10.Added updated “Packaging Information” on page 333.
Changes from Rev.
2503B-10/02 to
Rev. 2503C-10/02
1.
Updated the “DC Characteristics” on page 287.
Changes from Rev.
2503A-03/02 to
Rev. 2503B-10/02
1.
Canged the endurance on the Flash to 10,000 Write/Erase Cycles.
2.
Bit nr.4 – ADHSM – in SFIOR Register removed.
3.
Added the section “Default Clock Source” on page 25.
4.
When using External Clock there are some limitations regards to change of fre-
quency. This is described in “External Clock” on page 31 and Table 117 on page 289.
相关PDF资料
PIC18F2450-I/SP IC PIC MCU FLASH 8KX16 28DIP
PIC24FJ64GA006-I/PT IC PIC MCU FLASH 64KB 64TQFP
PIC18F26J53-I/SO IC PIC MCU 64KB FLASH 28SOIC
33FMN-BMTR-A-TB CONN FMN HSNG 33POS SGL REV SMD
31FMN-BMTR-A-TB CONN FMN HSNG 31POS SGL REV SMD
30FMN-BMTR-A-TB CONN FMN HSNG 30POS SGL REV SMD
PIC24EP64GP202-I/SO MCU 16BIT 64KB FLASH 28SOIC
DSPIC33EP64MC202-I/SO IC DSC 16BIT 64KB FLASH 28SOIC
相关代理商/技术参数
ATMEGA32L-8MC SL383 制造商:Atmel Corporation 功能描述:8 MHZ MLF COM TEMP 3V
ATMEGA32L-8MI 功能描述:8位微控制器 -MCU AVR 32K FLASH 2K SRAM 1KB EE - 8MHZ RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT
ATMEGA32L-8MI 08542 制造商:Atmel Corporation 功能描述:
ATMEGA32L-8MJ 功能描述:IC MCU AVR 32K 5V 8MHZ 44-QFN RoHS:是 类别:集成电路 (IC) >> 嵌入式 - 微控制器, 系列:AVR® ATmega 标准包装:9 系列:87C 核心处理器:8051 芯体尺寸:8-位 速度:40/20MHz 连通性:UART/USART 外围设备:POR,WDT 输入/输出数:32 程序存储器容量:32KB(32K x 8) 程序存储器类型:OTP EEPROM 大小:- RAM 容量:256 x 8 电压 - 电源 (Vcc/Vdd):4.5 V ~ 5.5 V 数据转换器:- 振荡器型:内部 工作温度:0°C ~ 70°C 封装/外壳:40-DIP(0.600",15.24mm) 包装:管件
ATmega32L-8MU 功能描述:8位微控制器 -MCU 32kB Flash 1kB EEPROM 32 I/O Pins RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT
ATMEGA32L-8MU SL602 制造商:Atmel Corporation 功能描述:
ATMEGA32L-8MUR 功能描述:8位微控制器 -MCU AVR 32K FLSH 2K SRAM 1KB EE-8MHZ IND RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT
ATMEGA32L-8PC 功能描述:8位微控制器 -MCU AVR 32K FLASH 2K SRAM 1KB EE - 8MHZ RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT